Job description
Our team has an immediate permanent opening for an Engineer.
Responsibilities:
- Responsible for advancing packaging technology for RF System in Package (SIP) applications, including SMT, wirebonding, molding, solder ball attachment, strip grinding, and EMI shielding
- Create, conduct, and analyze Design of Experiments (DOE) for the purpose of developing and sustaining programs
- Responsible for collaborating with the engineering team in the development of new products
Job requirements
What you’ll bring to the team:
- PHD in Electrical/Electronic Engineering with emphasis on RF and Microwave IC’s
- Experience with the RF circuit design process
- Understanding of all aspects of the hardware development cycle including requirements, architecture, simulation, schematic capture, PCB layout, power/thermal design, signal integrity, verification and manufacturing
- Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
- Experience with AutoCad is desired, experience with Solidworks is an asset
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