Engineer - RF Packaging

Huawei Canada has an immediate permanent opening for an Engineer.

About the team:

Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.

About the job:

• Responsible for advancing packaging technology for RF System in Package (SIP)  applications, including SMT, wirebonding, molding, solder ball attachment, strip grinding, and EMI shielding

• Create, conduct, and analyze Design of Experiments (DOE) for the purpose of developing and sustaining programs

• Responsible for collaborating with the engineering team in the development of new products

About the ideal candidate:

• PHD in Electrical/Electronic Engineering with emphasis on RF and Microwave IC’s

• Experience with the RF circuit design process

• Understanding of all aspects of the hardware development cycle including requirements, architecture, simulation, schematic capture, PCB layout, power/thermal design, signal integrity, verification and manufacturing

• Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)

• Experience with AutoCad is desired, experience with Solidworks is an asset