Engineer - RF Packaging

Our team has an immediate permanent opening for an Engineer.

Responsibilities:

• Responsible for advancing packaging technology for RF System in Package (SIP)  applications, including SMT, wirebonding, molding, solder ball attachment, strip grinding, and EMI shielding
• Create, conduct, and analyze Design of Experiments (DOE) for the purpose of developing and sustaining programs
• Responsible for collaborating with the engineering team in the development of new products

What you’ll bring to the team:

• PHD in Electrical/Electronic Engineering with emphasis on RF and Microwave IC’s
• Experience with the RF circuit design process
• Understanding of all aspects of the hardware development cycle including requirements, architecture, simulation, schematic capture, PCB layout, power/thermal design, signal integrity, verification and manufacturing
• Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
• Experience with AutoCad is desired, experience with Solidworks is an asset