Senior Engineer - AI Interconnect

Huawei Canada has an immediate permanent opening for a Senior Engineer.

About the Team:

Huawei Canada's Advanced Optical Technology Lab focuses on advanced R&D in high-performance optical communications and networking. Our expert team specializes in transmission algorithms, systems, physics, and optical network management. The lab engages in projects ranging from deep research to developing key product features, actively participating in standards organizations and collaborative research with partners. Our multicultural environment fosters innovation, mentorship, and a passion for learning. If you thrive on solving complex technical challenges, this lab is your ideal place.

About the Job:

• Model and design end-to-end interconnect systems, including RF, optical, and packaging elements.

• Develop traveling-wave and high-speed modulator designs, including line terminations, bias networks, and equalization.

• Perform link-level simulations (electro-optical co-design, SI/PI, bandwidth, and loss tradeoffs).

• Explore technology scaling paths for AI workloads, evaluating optical interconnect architectures and their impact on cluster efficiency.

• Collaborate with driver IC, packaging, and photonic design teams to co-optimize system performance.

• Build and automate test setups for device and subsystem characterization (eye diagrams, S-parameters, BER, jitter).

About the ideal candidate:

• PhD or Master’s Degree in Electrical Engineering, Photonics, Applied Physics, or a related discipline.

• 5+ years of experience in high-speed RF design or optical/electrical interconnects or silicon photonics.

• Proficiency with simulation tools (ADS, HFSS, CST, COMSOL, Lumerical, or similar); Hands-on lab experience with test instrumentation (VNAs, oscilloscopes, BER testers, optical analyzers).

• Solid understanding of transmission lines, impedance matching, and signal integrity.

• Experience with photonic or electro-optic modulator design and high-speed device characterization.

• Experience with data analysis pipelines for link characterization or yield optimization is an asset.

• Familiarity with AI/ML computing architectures and network scaling challenges is an asset.

• Knowledge of electro-optic co-packaging, thermal management, and advanced packaging design is an asset.

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