Job description
Our team has an immediate permanent opening for a Technical Expert.
Responsibilities:
- Investigate the evolution direction of advanced technologies, conduct exploration of advanced technologies, technology development and introduction
- Develop technology from the perspectives of design, reliability, etc., combined with chip architecture, electricity, heat, power, cost, etc. and transform it into chip solutions
- Responsible for the development and maintenance of HB, TCB, CMP, CVD and etching processes in the 2.5D/FOP advanced packaging NPI project
Job requirements
What you’ll bring to the team:
- Master's degree in Materials Science and Engineering, Semiconductors, Microelectronics, Mechanics, Mechanics, Physics, Chemistry and other majors
- Investigate the evolution direction of advanced technologies, conduct advanced technology exploration, technology development and introduction, etc.; conduct technology development and convert it into chips from the perspectives of design, reliability, etc., combined with chip architecture, electricity, heat, power, cost, etc.
- Process, DFM and NPI import experience; interface collaboration with different suppliers; material property analysis and reliability mechanism; thermal stress CPI analysis experience; wafer- and substrate-based interconnect technology experience; Co-design design experience
- Strong learning and innovation ability, relevant knowledge or work experience in the field of electronic packaging (HB, TCB, CMP, CVD, etching process)
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